Capability: 
Bonding/Process
Make/Model: 
Thermal Technologies
Purpose: 
Diffusion bonding of metal layers
Notes: 

Download Standard Operating Procedures (.pdf)

  • 3" diameter working envelope
  • 1150°C capability

Hourly Rates: 
OSU / Non-OSU: $47 / $94
Training: 

See trainer and contact information on the ATAMI Capabilities Training Staff page.