Capability: 
Patterning
Purpose: 
Pattering and developing photoresist
Notes: 
  • Semi-clean room contained equipment capable of SU-8 thick film processes (>50 micron capability) with feature sizes as small as 10um and 5:1 aspect ratio on substrates as large as 100mm
  • 6" wafer spin coater and Oriel UV exposure tool
  • SU8 processing
Hourly Rates: 
OSU / Non-OSU: $21 / $42
Training: 

See trainer and contact information on the ATAMI Capabilities Training Staff page.