Applications

  • Cutting materials - metal shims, glasses and even organic materials
  • Cutting and drilling in flex circuits.
  • Other PCB and device laser processing

Specifications and Features

  • 355 nm, 20 um diamter, focussed beam at the substrate
  • 350 x 350 x 11 mm working area (XYZ)
  • +/- 25 um positioning accuracy
  • Custom recipes (known as "tools") for your specific material application

 

Documents and Links