Skip to main content
OREGON STATE UNIVERSITY
Open search box
Oregon State University Advantage
»
Advanced Technology and Manufacturing Institute (ATAMI)
Toggle menu
Go to search page
Search Field
Exit Search
About
Mission and Goals
Capabilities
User Resources
Innovation Ecosystem
OSU Research Labs
Selected Faculty Publications
Student Publications
OSU Advantage Accelerator
ATAMI's Industry Tenants
Safety
ATAMI People
Jobs at ATAMI
Location
About
Mission and Goals
Capabilities
User Resources
Innovation Ecosystem
OSU Research Labs
Selected Faculty Publications
Student Publications
OSU Advantage Accelerator
ATAMI's Industry Tenants
Safety
ATAMI People
Jobs at ATAMI
Location
You are here
Home
»
ATAMI Tools
»
Bonding
Thermal Technology HP30-4560 Vacuum Hot Press
Applications
Precise application of hydraulic pressing force and simultaneous high temperature operation.
Sintering of metal or ceramic powders.
Difussion bonding of solid components
Specifications and Features
Up to 300kN force.
Maximum pressing temperature of 2500 C.
Vacuum to the 10
-3
torr range.
Simultaneous temperature and pressure control.
Rapid vacuum cycling (typical < 10 min)
Documents and Links
Standard Operating Procedure
Supplier website
Atami Usage and Service Rates
Atami Capabilities Training
tool_thermal_technology_vhp_main.jpg
‹ Bonding
up
Furnaces and High Temp Processing ›
ATAMI Tools
Continuous Flow Processing
Metrology and Material Characterization
Thin Film Processing and Patterning
Analytical Equipment
Lasers, Microscopes and Cameras
Machining and Micro-milling
Bonding
Thermal Technology HP30-4560 Vacuum Hot Press
Furnaces and High Temp Processing
Metallography
3D Printing
Metal Additive Manufacturing Lab
Miscellaneous Instruments
Fume Hoods